Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/05/2023
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Application #:
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17542883
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Filing Dt:
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12/06/2021
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Publication #:
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Pub Dt:
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03/24/2022
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Inventors:
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Pei Gong, Yan DENG
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Title:
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SEALING COVER AND MOLDING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 36, WANBAO NORTH STREET, ZHONGCUN WANBAO BASE |
| PANYU DISTRICT |
| GUANGZHOU CITY, GUANGDONG, CHINA 511495 |
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| SCHMEISER, OLSEN & WATTS, LLP |
| 22 CENTURY HILL DRIVE, SUITE 302 |
| LATHAM, NY 12110 |
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06/20/2024 01:59 PM
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