Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/17/2024
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Application #:
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17317368
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Filing Dt:
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05/11/2021
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Publication #:
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Pub Dt:
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03/31/2022
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Inventors:
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SEOKHYUN LEE, KYOUNG LIM SUK, JAEGWON JANG
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Title:
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SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129, SAMSUNG-RO |
| YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
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| MYERS BIGEL, P.A. |
| PO BOX 37428 |
| RALEIGH, NC 27627 |
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