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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/19/2023
Application #:
17380329
Filing Dt:
07/20/2021
Publication #:
Pub Dt:
03/31/2022
Inventors:
Xiaolei ZHOU, Wenbin KANG, Peng LIU
Title:
SEMICONDUCTOR ENCAPSULATION STRUCTURE AND ENCAPSULATION METHOD
Assignment: 1
Reel/Frame:
057143/0807Recorded: 07/21/2021Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/08/2021
Exec Dt:
07/08/2021
Exec Dt:
07/08/2021
Assignee:
158, JINCHANG ROAD, JINXI TOWN
KUNSHAN CITY, JIANGSU PROVINCE, CHINA 215324
Correspondent:
BIRCH STEWART KOLASCH & BIRCH LLP
8110 GATEHOUSE ROAD, SUITE 100E
FALLS CHURCH, VA 22042

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