Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/05/2024
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Application #:
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17201394
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Filing Dt:
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03/15/2021
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Publication #:
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Pub Dt:
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03/31/2022
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Inventors:
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Brad Zakaib, Kamal Mostafavi, Jarod Domingo, Yixuan Gao
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Title:
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LIQUID-COOLING DEVICES, AND SYSTEMS, TO COOL MULTI-CHIP MODULES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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#10, 2928 SUNRIDGE WAY NE |
CALGARY, CANADA T1Y 7H9 |
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GANZ POLLARD, LLC |
P.O. BOX 2200 |
HILLSBORO, OR 97123 |
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06/28/2024 05:21 AM
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