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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/05/2024
Application #:
17201394
Filing Dt:
03/15/2021
Publication #:
Pub Dt:
03/31/2022
Inventors:
Brad Zakaib, Kamal Mostafavi, Jarod Domingo, Yixuan Gao
Title:
LIQUID-COOLING DEVICES, AND SYSTEMS, TO COOL MULTI-CHIP MODULES
Assignment: 1
Reel/Frame:
055592/0120Recorded: 03/15/2021Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/28/2021
Exec Dt:
01/28/2021
Exec Dt:
01/28/2021
Exec Dt:
01/28/2021
Assignee:
#10, 2928 SUNRIDGE WAY NE
CALGARY, CANADA T1Y 7H9
Correspondent:
GANZ POLLARD, LLC
P.O. BOX 2200
HILLSBORO, OR 97123

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