Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17314356
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Filing Dt:
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05/07/2021
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Publication #:
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Pub Dt:
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04/07/2022
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Inventors:
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Anwar A. Mohammed, Harpuneet Singh
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Title:
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LOW TEMPERATURE, REWORKABLE, AND NO-UNDERFILL ATTACH PROCESS FOR FINE PITCH BALL GRID ARRAYS HAVING SOLDER BALLS WITH EPOXY AND SOLDER MATERIAL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10560 DR. MARTIN LUTHER KING JR. STREET, NORTH |
| ST. PETERSBURG, FLORIDA 33716 |
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| SHUMAKER, LOOP & KENDRICK LLP |
| 1000 JACKSON STREET |
| TOLEDO, OH 43604-5573 |
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