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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
17560086
Filing Dt:
12/22/2021
Publication #:
Pub Dt:
04/14/2022
Inventors:
Arvind Tirumalai, Archanna Srinivasan, Arch Zaliznyak, Hon Khet Chuah, Kok Kee Looi et al
Title:
Circuits And Methods For Sub-Bank Sharing Of External Interfaces
Assignment: 1
Reel/Frame:
058700/0001Recorded: 01/19/2022Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/26/2021
Exec Dt:
12/28/2021
Exec Dt:
01/15/2022
Exec Dt:
12/31/2021
Exec Dt:
01/05/2022
Exec Dt:
01/17/2022
Exec Dt:
01/15/2022
Assignee:
2200 MISSION COLLEGE BOULEVARD
SANTA CLARA, CALIFORNIA 95054
Correspondent:
INVENTIQ LEGAL LLP/INTEL CORP.
P.O. BOX 779
MENLO PARK, CA 94026-0779
Assignment: 2
Reel/Frame:
066353/0886Recorded: 01/19/2024Pages: 45
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/19/2023
Assignee:
101 INNOVATION DRIVE
SAN JOSE, CALIFORNIA 95134
Correspondent:
ANGELA MILLER
C/O CLARIVATE
P.O. BOX 5427
TUCSON, AZ 85703

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