Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/09/2024
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Application #:
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16949068
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Filing Dt:
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10/13/2020
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Publication #:
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Pub Dt:
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04/14/2022
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Inventors:
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Wai Tien Chan, Qian Sun, Ho Nam Lee
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Title:
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SEMICONDUCTOR DEVICE WITH TEMPERATURE SENSING COMPONENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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UNIT 611, 6/F BUILDING 12 W, PHASE 3 |
HONG KONG SCIENCE PARK, PAK SHEK KOK, TAI PO, N.T. |
HONG KONG, CHINA |
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CHARLES J. MEYER |
111 MONUMENT CIRCLE, SUITE 3700 |
INDIANAPOLIS, IN 46204 |
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06/14/2024 08:11 AM
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