Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/12/2023
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Application #:
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17556065
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Filing Dt:
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12/20/2021
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Publication #:
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Pub Dt:
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04/14/2022
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Inventors:
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Vijay DAGA, Jaydip DAS, Kavitha BHARADWAJ, Ting GAO, Quentin Francis POLOSKY et al
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Title:
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ASSEMBLY AND METHOD FOR SEALING A BUNDLE OF WIRES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1050 WESTLAKES DRIVE |
BERWYN, PENNSYLVANIA 19312 |
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THE WHITAKER LLC |
4550 LINDEN HILL ROAD |
WILMINGTON, DE 19808-2952 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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MUEHLENSTRASSE 26 |
SCHAFFHAUSEN, SWITZERLAND 8200 |
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TE CONNECTIVITY CORPORATION C/O THE WHIT |
4550 LINDEN HILL ROAD |
SUITE 140 |
WILMINGTON, DE 19808 |
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