Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/08/2023
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Application #:
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17220722
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Filing Dt:
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04/01/2021
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Publication #:
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Pub Dt:
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04/21/2022
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Inventors:
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Wei-Chih Chen, Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo
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Title:
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INTEGRATED FAN OUT METHOD UTILIZING A FILLER-FREE INSULATING MATERIAL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| SLATER MATSIL, LLP/TSMC |
| 17950 PRESTON ROAD, SUITE 1000 |
| DALLAS, TX 75252 |
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05/31/2024 03:13 PM
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