Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17537719
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Filing Dt:
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11/30/2021
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Publication #:
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Pub Dt:
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04/21/2022
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Inventors:
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Mitsuo TAKADA, Nanako MAEDA, Osamu MATSUZAWA, Ryo ISHIKAWA, Takuya KOBAYASHI
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Title:
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PALLADIUM-COATED COPPER BONDING WIRE, MANUFACTURING METHOD OF PALLADIUM-COATED COPPER BONDING WIRE, SEMICONDUCTOR DEVICE USING THE SAME, AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2303-15, YOSHIDA, YOSHINOGARI-CHO |
KANZAKI-GUN, SAGA, JAPAN 842-0031 |
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ORRICK, HERRINGTON & SUTCLIFFE LLP |
2050 MAIN STREET, SUITE 1100 |
IRVINE, CA 92614 |
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