Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17429724
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Filing Dt:
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08/10/2021
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Publication #:
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Pub Dt:
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04/28/2022
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Inventors:
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Masato SHIRATORI, Motohiro ONITSUKA, Akiko TAKAKI, Hiroyoshi KAWASAKI, Yoko KURASAWA et al
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Title:
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RESIN COMPOSITION FOR SOLDERING USE, SOLDER COMPOSITION, FLUX CORED SOLDER, FLUX, AND SOLDER PASTE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 23, SENJU-HASHIDO-CHO |
| ADACHI-KU, TOKYO, JAPAN 120-8555 |
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| NIXON PEABODY LLP |
| 799 9TH STREET |
| SUITE 500 |
| WASHINGTON, DC 20001 |
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