Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17509590
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Filing Dt:
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10/25/2021
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Publication #:
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Pub Dt:
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04/28/2022
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Inventors:
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Eunpyeong HONG, Wonmo JUNG, Sejin PARK, Hyunwoo OH, Dong Soo LEE, Weon Jin KIM et al
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Title:
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ESTIMATING A THICKNESS OF CORTICAL REGION BY EXTRACTING A PLURALITY OF INTERFACES AS MESH DATA
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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6F, 507, GANGNAM-DAERO, SEOCHO-GU |
SEOUL, KOREA, REPUBLIC OF 06536 |
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SEED IP LAW GROUP LLP |
701 FIFTH AVENUE |
SUITE 5400 |
SEATTLE, WA 98104 |
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