Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/01/2023
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Application #:
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17394372
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Filing Dt:
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08/04/2021
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Publication #:
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Pub Dt:
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04/28/2022
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Inventors:
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Tse-Hsien Wu, Yu-Hsiang Chien, Shih-Ping Lee, Pin-Chieh Huang, Yeh-Yu Chiang
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Title:
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THROUGH SILICON VIA AND METHOD OF MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.18, LI-HSIN RD. 1, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN |
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| WINSTON HSU |
| 5F., NO.389, FUHE RD., YONGHE DIST., |
| NEW TAIPEI CITY, TAIWAN |
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