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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/27/2024
Application #:
17431363
Filing Dt:
08/16/2021
Publication #:
Pub Dt:
05/05/2022
Inventors:
Keita KITAZAWA, Wataru TOYA
Title:
NON-CURABLE THERMAL-CONDUCTIVE SILICONE COMPOSITION
Assignment: 1
Reel/Frame:
057192/0309Recorded: 08/16/2021Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/19/2021
Exec Dt:
07/19/2021
Assignee:
6-1, OHTEMACHI 2-CHOME, CHIYODA-KU
TOKYO, JAPAN
Correspondent:
AARON L. WEBB
OLIFF PLC
P.O. BOX 320850
ALEXANDRIA, VA 22320-4850

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