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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
06/25/2024
Application #:
17516428
Filing Dt:
11/01/2021
Publication #:
Pub Dt:
05/05/2022
Inventors:
Byungchul YOO, Mun Ja KIM, Haeshin LEE, Yunhan LEE, Chang Young JEONG
Title:
ADHESIVE COMPOSITION, METHOD FOR PREPARING THE SAME, RETICLE ASSEMBLY INCLUDING THE SAME, AND METHOD FOR FABRICATING RETICLE ASSEMBLY INCLUDING THE SAME
Assignment: 1
Reel/Frame:
058382/0408Recorded: 12/14/2021Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/01/2021
Exec Dt:
06/01/2021
Exec Dt:
06/04/2021
Exec Dt:
06/01/2021
Exec Dt:
06/04/2021
Assignees:
129, SAMSUNG-RO, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677
291, DAEHAK-RO, YUSEONG-GU
DAEJEON, KOREA, REPUBLIC OF 34141
Correspondent:
MUIR PATENT LAW, PLLC
P.O. BOX 1213
GREAT FALLS, VA 22066

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