Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/30/2024
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Application #:
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17472919
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Filing Dt:
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09/13/2021
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Publication #:
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Pub Dt:
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05/05/2022
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Inventors:
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Yu Ren, Kaiqu Ang, Jin Xu, Zaifeng Tang
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Title:
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Wafer Transfer Module and Method Thereof for Transferring To-Be-Transferred Wafer
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 6 LIANGTENG ROAD |
PUDONG NEW AREA |
SHANGHAI, CHINA 201314 |
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BANNER & WITCOFF, LTD. |
71 SOUTH WACKER DRIVE |
SUITE 3600 |
CHICAGO, IL 60606 |
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06/18/2024 01:44 AM
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