Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/04/2023
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Application #:
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17317343
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Filing Dt:
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05/11/2021
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Publication #:
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Pub Dt:
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05/05/2022
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Inventors:
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Sung-Yuan Lin, Yu-Hsin Wang, Che-Ming Hsu, Nai-Jen Hsuan
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Title:
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BALL GRID ARRAY PACKAGE AND PACKAGE SUBSTRATE THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO.2, INNOVATION RD. II, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN |
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BIRCH, STEWART, KOLASCH & BIRCH, LLP. |
8110 GATEHOUSE ROAD, SUITE 100E |
FALLS CHURCH, VA 22040-0747 |
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09/25/2024 12:04 AM
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