Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/13/2023
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Application #:
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17095655
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Filing Dt:
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11/11/2020
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Publication #:
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Pub Dt:
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05/12/2022
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Inventors:
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Youmin Wang, Anan Pan
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Title:
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DETACHABLE MEMS PACKAGE TOP COVER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 218, 2ND FLOOR, BUILDING 34 NO. 8 DONGBEIWANG WEST ROAD, HAIDIAN DISTRICT |
| BEIJING, CHINA |
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| KILPATRICK TOWNSEND & STOCKTON LLP |
| TWO EMBARCARDERO CENTER |
| SUITE 1900 |
| SAN FRANCISCO, CA 94111 |
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