Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/07/2024
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Application #:
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17432770
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Filing Dt:
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08/20/2021
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Publication #:
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Pub Dt:
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05/12/2022
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Inventors:
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Nen NGUYENDINH, Ali Aryo BAWONO, Oscar Augusto Cesar AMESTEGUI AGUILAR et al
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Title:
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CONNECTION ASSEMBLY, LEVELLING OR LIFTING SYSTEM, AND METHOD OF LEVELLING A SLAB
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 50 NANYANG AVENUE |
| SINGAPORE, SINGAPORE 639798 |
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| 1 CREATE WAY, #10-02, CREATE TOWER |
| SINGAPORE, SINGAPORE 138602 |
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| BRADLEY J. ZENTZ |
| SEED IP LAW GROUP LLP |
| 701 FIFTH AVENUE, SUITE 5400 |
| SEATTLE, WA 98104 |
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