Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/04/2023
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Application #:
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17198653
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Filing Dt:
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03/11/2021
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Publication #:
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Pub Dt:
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05/12/2022
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Inventors:
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Chun-Te Lin, Chih-Yen SU
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Title:
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SEMICONDUCTOR PACKAGE
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO.10, DATONG RD. |
HUKOU TOWNSHIP, HSINCHU COUNTY, UNITED STATES 30352 |
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JAMES WALTERS; PATENTTM.US |
P.O. BOX 82788 |
PORTLAND, OR 97282-0788 |
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