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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
11742296
Issue Dt:
08/29/2023
Application #:
17134925
Filing Dt:
12/28/2020
Publication #:
20220148975
Pub Dt:
05/12/2022
Inventors:
Wei-Jhen Chen, Chih-Hsun Hsu, Yuan-Hung Hsu, Chih-Nan Lin, Chang-Fu Lin, Don-Son Jiang et al
Title:
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
Assignment: 1
Reel/Frame:
054754/0819Recorded: 12/28/2020Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CHEN, WEI-JHEN
Exec Dt:
12/20/2020
HSU, CHIH-HSUN
Exec Dt:
12/20/2020
HSU, YUAN-HUNG
Exec Dt:
12/20/2020
LIN, CHIH-NAN
Exec Dt:
12/20/2020
LIN, CHANG-FU
Exec Dt:
12/20/2020
JIANG, DON-SON
Exec Dt:
12/20/2020
HUANG, CHIH-MING
Exec Dt:
12/20/2020
CHEN, YI-HSIN
Exec Dt:
12/20/2020
Assignee:
SILICONWARE PRECISION INDUSTRIES CO., LTD.
NO.123, SEC. 3, DAFENG RD., TANZI DIST.
TAICHUNG CITY, TAIWAN 427
Correspondent:
SCOTT W. KELLEY
6320 CANOGA AVENUE
SUITE 1650
WOODLAND HILLS, CA 91367

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