Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17524720
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Filing Dt:
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11/11/2021
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Publication #:
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Pub Dt:
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05/12/2022
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Inventors:
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Byung Cheol KIM, Yong Tae KWON, Hyo Gi JO, Dong Hoon OH, Jae Cheon LEE, Hyung Jin SHIN et al
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Title:
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SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 105, GEUMIL-RO 965BEON-GIL, SAMSEONG-MYEON, EUMSEONG-GUN, |
| CHUNGCHEONGBUK-DO, KOREA, REPUBLIC OF 27651 |
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| 587-32, GWAHAKSANEOP 2-RO, OCHANG-EUP, CHEONGWON-GU, CHEONGJU-SI, |
| CHUNGCHEONGBUK-DO, KOREA, REPUBLIC OF 28116 |
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| JCIPRNET |
| 8F-1, NO. 100, ROOSEVELT RD. SEC. 2, |
| TAIPEI, 100404 TAIWAN |
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