Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17592490
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Filing Dt:
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02/03/2022
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Publication #:
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Pub Dt:
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05/19/2022
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Inventors:
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Yung-Cheng Lee, Yunda Wang, Ryan John Lewis, Li-Anne Liew
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Title:
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POLYMER-BASED MICROFABRICATED THERMAL GROUND PLANE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1800 GRANT STREET |
| 8TH FLOOR |
| DENVER, COLORADO 80203 |
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| SANDERS IP |
| 240 N EAST PROMONTORY |
| SUITE 200 |
| FARMINGTON, UT 84025 |
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