Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17485339
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Filing Dt:
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09/25/2021
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Publication #:
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Pub Dt:
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05/19/2022
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Inventors:
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Heng-Chi Huang, Yong-Zhong Hu, Hao-Lin Yen
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Title:
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CHIP PACKAGING METHOD AND CHIP PACKAGE UNIT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 14F., NO. 8, TAIYUAN 1ST ST. |
| ZHUBEI CITY, HSINCHU, TAIWAN |
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| RANDY TUNG |
| 7010 MIDDLEBELT ROAD |
| GARDEN CITY, MI 48301 |
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09/21/2024 05:56 PM
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