Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/16/2024
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Application #:
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17592161
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Filing Dt:
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02/03/2022
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Publication #:
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Pub Dt:
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05/19/2022
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Inventors:
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Chunho Kim, Mark E. Henschel
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Title:
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METHOD OF FORMING INTEGRATED CIRCUIT PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 710 MEDTRONIC PARKWAY N.E. |
| MINNEAPOLIS, MINNESOTA 55432-5604 |
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| DENISE LAGRO |
| 111 WASHINGTON AVENUE SOUTH, SUITE 700 |
| MINNEAPOLIS, MN 55401 |
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06/25/2024 10:35 AM
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