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Patent Assignment Abstract of Title

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Total Assignments: 2

Patent #:	11813863	Issue Dt:	11/14/2023	Application #:	17468271	Filing Dt:	09/07/2021
Publication #:	20220161556	Pub Dt:	05/26/2022
Inventors:	Hao-Jan Mou, Ying-Lun Chang, Hsien-Chung Tai, Yung-Lung Han, Chi-Feng Huang et al
Title:	WAFER STRUCTURE

Assignment: 1

Reel/Frame:

063797/0704

Recorded: 05/30/2023

Pages: 5

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

MOU, HAO-JAN

Exec Dt:

05/01/2023

CHANG, YING-LUN

Exec Dt:

03/13/2023

TAI, HSIEN-CHUNG

Exec Dt:

03/20/2023

HAN, YUNG-LUNG

Exec Dt:

03/22/2023

HUANG, CHI-FENG

Exec Dt:

03/20/2023

HSIEH, CHIN-WEN

Exec Dt:

03/20/2023

Assignee:

MICROJET TECHNOLOGY CO., LTD

NO. 28, R&D 2ND RD, SCIENCE-BASED INDUSTRIAL PARK

HSINCHU, TAIWAN

Correspondent:

JACOB LIEBER

8110 GATEHOUSE ROAD

FALLS CHURCH, VA 22042

Assignment: 2

Reel/Frame:

064219/0762

Recorded: 06/01/2023

Pages: 8

Conveyance:

CORRECTIVE ASSIGNMENT TO CORRECT THE CORRESPONDENT NAME AND CORRESPONDENT ADDRESS PREVIOUSLY RECORDED AT REEL: 063797 FRAME: 0704. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.

Assignors:

MOU, HAO-JAN

Exec Dt:

05/01/2023