Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
|
Issue Dt:
|
09/24/2024
|
Application #:
|
17527226
|
Filing Dt:
|
11/16/2021
|
Publication #:
|
|
Pub Dt:
|
05/26/2022
| | | | |
Inventor:
|
Che-Wei Hsu
|
Title:
|
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
NO.458-17, XINXING RD., HUKOU TOWNSHIP |
HSINCHU COUNTY, TAIWAN 30353 |
|
|
|
MCCLURE, QUALEY & RODACK, LLP |
280 INTERSTATE NORTH CIRCLE |
SUITE 550 |
ATLANTA, GA 30339 |
|
|
Search Results as of:
09/25/2024 10:48 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|