Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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10/08/2024
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Application #:
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17667645
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Filing Dt:
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02/09/2022
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Publication #:
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Pub Dt:
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05/26/2022
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Inventors:
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YongIk Choi, Michael Leary, Chang Kyu Choi, Li Sun, Chris Chung, Domingo Figueredo et al
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Title:
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SUBSTRATE HAVING UNDERCUT PORTION FOR STRESS MITIGATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1 YISHUN AVENUE 7 |
SINGAPORE, SINGAPORE 768923 |
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FOLEY & LARDNER LLP |
111 HUNTINGTON AVENUE |
SUITE 2500 |
BOSTON, 02199 UNITED STATES |
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09/21/2024 08:10 AM
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