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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
17432512
Filing Dt:
08/20/2021
Publication #:
Pub Dt:
05/26/2022
Inventors:
Christoph Döppe, Dominik Halacz
Title:
METHOD FOR REPAIRING SOLDER JOINT LEAKAGES AND WELDING OR SOLDERING APPARATUS FOR CARRYING OUT THE METHOD
Assignment: 1
Reel/Frame:
059316/0130Recorded: 03/19/2022Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/17/2022
Exec Dt:
02/21/2022
Assignee:
WERNER-VON-SIEMENS-STR. 1
MUNICH, GERMANY 80333
Correspondent:
WOLTER VANDYKE DAVIS, PLLC MAIL STOP AG
1900 SUMMIT TOWER BLVD., SUITE 140
ORLANDO, FL 32810
Assignment: 2
Reel/Frame:
059316/0127Recorded: 03/19/2022Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
03/08/2022
Assignee:
WERNER-VON-SIEMENS-STR. 1
MUNICH, GERMANY 81739
Correspondent:
WOLTER VANDYKE DAVIS, PLLC MAIL STOP AG
1900 SUMMIT TOWER BLVD., SUITE 140
ORLANDO, FL 32810

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