Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/09/2024
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Application #:
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17675346
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Filing Dt:
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02/18/2022
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Publication #:
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Pub Dt:
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06/02/2022
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Inventors:
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Jae Sung PARK, Hyoung Uk KIM, Hyung Soon KWON, Jong Han KIM, Jeong Ryeol KIM
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Title:
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DIELECTRIC COMPOSITION AND MULTILAYER ELECTRONIC COMPONENT INCLUDING THE SAME
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU |
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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HOSANG LEE |
MORGAN, LEWIS & BOCKIUS LLP |
1111 PENNSYLVANIA AVENUE NW |
WASHINGTON, DC 20004 |
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09/23/2024 11:37 AM
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