Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17651621
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Filing Dt:
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02/18/2022
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Publication #:
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Pub Dt:
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06/02/2022
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Inventors:
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Inpil YOO, Seungwon IM, JooYang EOM, Jerome TEYSSEYRE
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Title:
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CLIPS FOR SEMICONDUCTOR PACKAGE AND RELATED METHODS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5005 E. MCDOWELL ROAD, MD A700 |
| PHOENIX, ARIZONA 85008 |
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| SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 5005 E. MCDOWELL ROAD |
| MD A700 |
| PHOENIX, AZ 85008 |
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Assignment:
2
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 60 WALL STREET |
| NEW YORK, NEW YORK 10005 |
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| SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 5005 E. MCDOWELL ROAD |
| MD A700 |
| PHOENIX, AZ 85008 |
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Assignment:
3
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RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 059847, FRAME 0433
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| 5005 EAST MCDOWELL ROAD, MAILDROP A700 |
| PHOENIX, ARIZONA 85008 |
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| SYDNEY CRUTE |
| 1221 AVENUE OF THE AMERICAS |
| NEW YORK, NY 10020-1095 |
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Assignment:
4
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4 CHASE METROTECH CENTER, MC: NY1-C413 |
| BROOKLYN, NEW YORK 11245-0001 |
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| RAFAEL ALBERTO GRILLO AVILA |
| MORRISON & FOERSTER LLP |
| 425 MARKET STREET |
| SAN FRANCISCO, CA 94105 |
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