Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/05/2023
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Application #:
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17536158
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Filing Dt:
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11/29/2021
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Publication #:
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Pub Dt:
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06/02/2022
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Inventors:
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Chun-Hsien Yu, Shih-Ping Hsu, Hsien-Ming Tsai
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Title:
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SEMICONDUCTOR PACKAGE DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.458-17, XINXING RD., HUKOU TOWNSHIP |
| HSINCHU COUNTY, TAIWAN 30353 |
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| MCCLURE, QUALEY & RODACK, LLP |
| 280 INTERSTATE NORTH CIRCLE |
| SUITE 550 |
| ATLANTA, GA 30339 |
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06/22/2025 03:55 AM
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