Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/12/2024
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Application #:
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17682948
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Filing Dt:
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02/28/2022
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Publication #:
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Pub Dt:
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06/09/2022
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Inventors:
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Chin Hui Chong, Hong Wan Ng, Kelvin Tan Aik Boo, Seng Kim Ye, Hem P. Takiar
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Title:
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INTEGRATED CIRCUIT WIRE BONDED TO A MULTI-LAYER SUBSTRATE HAVING AN OPEN AREA THAT EXPOSES WIRE BOND PADS AT A SURFACE OF THE INNER LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 800 SOUTH FEDERAL WAY |
| BOIE, IDAHO 83716-9632 |
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| PATENT DOCKET ADMINISTRATOR |
| LOWENSTEIN SANDLER LLP |
| ONE LOWENSTEIN DRIVE |
| ROSELAND, NJ 07068 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8000 SOUTH FEDERAL WAY |
| BOISE, IDAHO 83716-9632 |
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| PATENT DOCKET ADMINISTRATOR |
| LOWENSTEIN SANDLER LLP |
| ONE LOWENSTEIN DRIVE |
| ROSELAND, NJ 07068 |
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05/23/2024 07:15 AM
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