Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/09/2022
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Application #:
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17151343
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Filing Dt:
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01/18/2021
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Publication #:
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Pub Dt:
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06/09/2022
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Inventors:
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Anupam Dutta, Venkata N.R. Vanukuru, John J. Ellis-Monaghan, Satyasuresh V. Choppalli et al
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Title:
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INTEGRATED CIRCUIT (IC) STRUCTURE WITH HIGH IMPEDANCE SEMICONDUCTOR MATERIAL BETWEEN SUBSTRATE AND TRANSISTOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2600 GREAT AMERICA WAY |
SANTA CLARA, CALIFORNIA 95054 |
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HOFFMAN WARNICK LLC |
540 BROADWAY |
4TH FLOOR |
ALBANY, NY 12207 |
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09/24/2024 09:49 AM
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