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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
11/22/2022
Application #:
17335375
Filing Dt:
06/01/2021
Publication #:
Pub Dt:
06/16/2022
Inventors:
Zhiming Liu, Michael Lebby, Baoquan Chen
Title:
HYBRID EO POLYMER MODULATOR WITH ALD SEALANT LAYER
Assignment: 1
Reel/Frame:
060810/0380Recorded: 08/15/2022Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/08/2022
Exec Dt:
08/08/2022
Exec Dt:
08/08/2022
Assignee:
369 INVERNESS PARKWAY
SUITE 350
ENGLEWOOD, COLORADO 80112
Correspondent:
ROBERT A. PARSONS
10643 N. FRANK LLOYD WRIGHT BLVD.
SUITE 201
SCOTTSDALE, AZ 85259

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