Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
08/13/2024
|
Application #:
|
17551387
|
Filing Dt:
|
12/15/2021
|
|
Publication #:
|
|
Pub Dt:
|
06/16/2022
| | | | |
|
Inventors:
|
Yeongseok Kim, Joungphil Lee
|
|
Title:
|
NON-CONDUCTIVE FILM SHEET AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 129, SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
|
|
|
|
| CAREY GREGORY/MYERS BIGEL |
| PO BOX 37428 |
| RALEIGH, NC 27627 |
|
|
Search Results as of:
11/11/2024 08:24 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
