Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/19/2024
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Application #:
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17600999
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Filing Dt:
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10/01/2021
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Publication #:
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Pub Dt:
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06/23/2022
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Inventors:
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Wenbing YANG, Samantha SiamHwa TAN, Yiwen FAN, Tamal MUKHERJEE, Yang PAN, Mohand BROURI et al
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Title:
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ATOMIC LAYER ETCHING FOR SUBTRACTIVE METAL ETCH
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4650 CUSHING PARKWAY |
| FREMONT, CALIFORNIA 94538 |
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| BEYER LAW GROUP LLP |
| P.O. BOX 51887 |
| PALO ALTO, CA 94303 |
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05/14/2024 01:15 PM
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