Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/14/2023
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Application #:
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17148082
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Filing Dt:
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01/13/2021
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Publication #:
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Pub Dt:
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06/23/2022
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Inventors:
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Jongho YOON, Min PARK
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Title:
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DIE DIVISION METHOD AND INSPECTION APPARATUS FOR AVOIDING DEFECTS LOCATIONS ON SILICON CARBIDE WAFERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 280-17, SANEOP-RO 155BEON-GIL, GWONSEON-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16648 |
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| KNOBBE, MARTENS, OLSON & BEAR LLP |
| 2040 MAIN STREET |
| 14TH FLOOR |
| IRVINE, CA 92614 |
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06/25/2024 07:33 PM
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