Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/27/2024
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Application #:
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17261756
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Filing Dt:
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01/20/2021
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Publication #:
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Pub Dt:
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06/23/2022
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Inventors:
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Hong WEN, Yicheng CHEN
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Title:
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CHIP-ON-FILM PACKAGING STRUCTURE AND CHIP-ON-FILM PACKAGING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 305 ROOM, BLDG C5, BIOLAKE OF OPTICS VALLEY,NO.666 |
| GAOXIN AVE, EAST LAKE HIGH-TECH DEV ZONE |
| WUHAN, ISRAEL 430079 |
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| THE ROY GROSS LAW FIRM, LLC |
| 50 WASHINGTON STREET |
| SUITE 737/745 |
| NORWALK, CT 06854 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE THE ASSIGNEE ADDRESS PREVIOUSLY RECORDED AT REEL: 054969 FRAME: 0805. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 305 ROOM, BLDG C5, BIOLAKE OF OPTICS VALLEY, NO. 666 |
| GAOXIN AVE, WUHAN EAST LAKE HIGH-TECH DEVELOPMENT ZONE |
| WUHAN, HUBEI, CHINA 430079 |
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| THE ROY GROSS LAW FIRM, LLC |
| 101 MERRITT 7, SUITE 300 |
| NORWALK, CT 06851 |
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06/22/2025 03:41 AM
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