Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/02/2023
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Application #:
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17695118
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Filing Dt:
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03/15/2022
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Publication #:
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Pub Dt:
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06/23/2022
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Inventors:
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Aleksandar Aleksov, Telesphor Kamgaing, Georgios Dogiamis, Feras Eid, Johanna M. Swan
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Title:
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MICROELECTRONIC PACKAGE WITH SUBSTRATE-INTEGRATED COMPONENTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2200 MISSION COLLEGE BOULEVARD |
SANTA CLARA, CALIFORNIA 95054 |
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MANJULA VARIYAM |
4524 BRIAR HOLLOW DRIVE |
PATENT CAPITAL GROUP |
PLANO, TX 75093 |
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06/07/2024 04:51 AM
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