Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/23/2024
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Application #:
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17554835
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Filing Dt:
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12/17/2021
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Publication #:
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Pub Dt:
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06/30/2022
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Inventors:
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Tien-Heng HUANG, Yu-Han WU, Kuo-Chuang CHIU
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Title:
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Ceramic material and wire bonding capillary
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 195, SEC. 4, CHUNG HSING RD., CHUTUNG |
| HSINCHU, TAIWAN 310401 |
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| NELSON QUINTERO |
| 615 HAMPTON DRIVE SUITE A202 |
| VENICE, CA 90291 |
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05/13/2024 08:05 AM
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