Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/14/2023
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Application #:
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17136408
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Filing Dt:
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12/29/2020
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Publication #:
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Pub Dt:
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06/30/2022
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Inventors:
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Boon Yew Low, Fernando A. Santos, Li Li, Fui Yee Lim, Lan Chu Tan
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Title:
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CIRCUIT MODULES WITH FRONT-SIDE INTERPOSER TERMINALS AND THROUGH-MODULE THERMAL DISSIPATION STRUCTURES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6501 WILLIAM CANNON DRIVE WEST |
| AUSTIN, TEXAS 78735 |
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| NXP USA, INC. LAW DEPARTMENT |
| 6501 WILLIAM CANNON DRIVE WEST TX30/OE62 |
| AUSTIN, TX 78735 |
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