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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
11830746
Issue Dt:
11/28/2023
Application #:
17141835
Filing Dt:
01/05/2021
Publication #:
20220216071
Pub Dt:
07/07/2022
Inventors:
Hao-Jan Pei, Chih-Chiang Tsao, Philip Yu-Shuan Chung, Hsiu-Jen Lin, Wei-Yu Chen et al
Title:
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
Assignment: 1
Reel/Frame:
054817/0194Recorded: 01/05/2021Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
YU, JEN-JUI
Exec Dt:
08/31/2020
CHUNG, PHILIP YU-SHUAN
Exec Dt:
08/31/2020
CHANG, CHIA-LUN
Exec Dt:
09/15/2020
LIN, HSIU-JEN
Exec Dt:
09/15/2020
CHEN, WEI-YU
Exec Dt:
08/31/2020
PEI, HAO-JAN
Exec Dt:
08/31/2020
KUO, HSUAN-TING
Exec Dt:
09/04/2020
TSAO, CHIH-CHIANG
Exec Dt:
09/01/2020
HSIEH, CHING-HUA
Exec Dt:
09/15/2020
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
SLATER MATSIL, LLP/TSMC
17950 PRESTON ROAD, SUITE 1000
DALLAS, TX 75252

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