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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
17601914
Filing Dt:
10/06/2021
Publication #:
20220216244
Pub Dt:
07/07/2022
Inventors:
Gerhard EILMSTEINER, Patrik PERTL, Hannes BRANDNER
Title:
ON-CHIP INTEGRATION OF INDIUM TIN OXIDE (ITO) LAYERS FOR OHMIC CONTACT TO BOND PADS
Assignment: 1
Reel/Frame:
057984/0026Recorded: 11/01/2021Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
EILMSTEINER, GERHARD
Exec Dt:
10/18/2021
BRANDNER, HANNES
Exec Dt:
10/15/2021
PERTL, PATRIK
Exec Dt:
10/15/2021
Assignee:
AMS AG
TOBELBADER STRASSE 30
PREMSTAETTEN, AUSTRIA 8141
Correspondent:
TAROLLI, SUNDHEIM, COVELL & TUMMINO L.L.P.
1300 EAST NINTH STREET
SUITE 1700
CLEVELAND, OH 44114
Assignment: 2
Reel/Frame:
057992/0385Recorded: 11/02/2021Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
EILMSTEINER, GERHARD
Exec Dt:
10/18/2021
BRANDNER, HANNES
Exec Dt:
10/15/2021
PERTL, PATRIK
Exec Dt:
10/15/2021
Assignee:
AMS AG
TOBELBADER STRASSE 30
PREMSTAETTEN, AUSTRIA 8141
Correspondent:
TAROLLI, SUNDHEIM, COVELL & TUMMINO L.L.P.
1300 EAST NINTH STREET
SUITE 1700
CLEVELAND, OH 44114

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