Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
07/18/2023
|
Application #:
|
17351664
|
Filing Dt:
|
06/18/2021
|
|
Publication #:
|
|
Pub Dt:
|
07/07/2022
| | | | |
|
Inventors:
|
Yanwen BAI, Shiann-Ming LIOU, Gang ZHAO, Lin CHEN
|
|
Title:
|
Multilayer Circuit Board
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 2 FLOOR, #1, LANE 500, SHENGXIA ROAD, PUDONG |
| SHANGHAI, CHINA 201210 |
|
|
|
|
| WOMBLE BOND DICKINSON(US) LLP/KGS ATTN: |
| P.O. BOX 7037 |
| ATLANTA, GA 30357-0037 |
|
|
Search Results as of:
06/21/2024 07:59 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
