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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17711986
Filing Dt:
04/01/2022
Publication #:
20220222194
Pub Dt:
07/14/2022
Inventors:
Neelam CHANDWANI, Rajesh VIVEKANANDHAM, Eric J. DAHLEN, Chung-Chi WANG, Hosein NIKOPOUR et al
Title:
ON-PACKAGE ACCELERATOR COMPLEX (AC) FOR INTEGRATING ACCELERATOR AND IOS FOR SCALABLE RAN AND EDGE CLOUD SOLUTION
Assignment: 1
Reel/Frame:
062419/0861Recorded: 01/18/2023Pages: 38
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CHANDWANI, NEELAM
Exec Dt:
01/05/2023
BENDI, SHRIDHAR
Exec Dt:
06/10/2022
VIVEKANANDHAM, RAJESH
Exec Dt:
06/16/2022
PAL, RAHUL
Exec Dt:
06/09/2022
DAHLEN, ERIC J.
Exec Dt:
04/12/2022
HASBUN MARIN, ANTONIO J.
Exec Dt:
04/05/2022
WANG, CHUNG-CHI
Exec Dt:
06/10/2022
LI, QIAN
Exec Dt:
04/30/2022
NIKOPOUR, HOSEIN
Exec Dt:
04/05/2022
KOTA VENKATA, SRAVANTHI
Exec Dt:
05/22/2022
POORNACHANDRAN, RAJESH
Exec Dt:
04/27/2022
MUKHERJEE, UDAYAN
Exec Dt:
01/09/2023
Assignee:
INTEL CORPORATION
2200 MISSION COLLEGE BLVD
SANTA CLARA, CALIFORNIA 95054
Correspondent:
R. ALAN BURNETT
4804 NW BETHANY BLVD, STE. I-2 #237
PORTLAND, OR 97229

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