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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/04/2023
Application #:
17146936
Filing Dt:
01/12/2021
Publication #:
Pub Dt:
07/14/2022
Inventors:
Ju-Hsien LIN, Jung-Tao CHUNG, Shu-Hsiao TSAI, Hsi-Tsung LIN, Chen-An HSIEH, Yi-Han CHEN et al
Title:
SEMICONDUCTOR STRUCTURE
Assignment: 1
Reel/Frame:
054893/0017Recorded: 01/12/2021Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/08/2021
Exec Dt:
01/08/2021
Exec Dt:
01/08/2021
Exec Dt:
01/08/2021
Exec Dt:
01/08/2021
Exec Dt:
01/08/2021
Exec Dt:
01/08/2021
Assignee:
NO. 69, KEJI 7TH RD., GUISHAN DIST.
TAOYUAN CITY, TAIWAN 33383
Correspondent:
MCCLURE, QUALEY & RODACK, LLP
280 INTERSTATE NORTH CIRCLE SE
SUITE 550
ATLANTA, GA 30339

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