Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17614434
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Filing Dt:
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11/26/2021
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Publication #:
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Pub Dt:
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07/21/2022
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Inventors:
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Wei WANG, Ping LI, Yanhao PENG, Nianchu HU, Bin JIA
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Title:
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CHIP ENCAPSULATION STRUCTURE AND ENCAPSULATION METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 19F, BLOCK E, XIAMEN CENTER BUILDING |
| NO. 555 HAICANG AVENUE, HAICANG DISTRICT |
| XIAMEN, FUJIAN, CHINA 361026 |
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| MERCHANT & GOULD P.C. |
| P.O. BOX 2903 |
| MINNEAPOLIS, MN 55402-0903 |
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