Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/27/2024
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Application #:
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17620644
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Filing Dt:
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12/17/2021
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Publication #:
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Pub Dt:
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08/04/2022
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Inventors:
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Robert Felix BYWALEZ, Ute STEINHAEUSSER, Monika SCHMIEDGEN
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Title:
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ELECTRIC COMPONENT WITH PAD FOR A BUMP AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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ANZINGER STR. 13 |
MUNICH, GERMANY 81671 |
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POLSINELLI |
THREE EMBARCADERO CENTER, SUITE 2400 |
SAN FRANCISCO, CA 94111 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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80 ROBINSON ROAD |
#02-00 |
SINGAPORE, SINGAPORE 068898 |
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QUALCOMM INCORPORATED |
5775 MOREHOUSE DRIVE |
SAN DIEGO, CA 92121 |
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09/23/2024 12:50 AM
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