Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/12/2024
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Application #:
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17666790
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Filing Dt:
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02/08/2022
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Publication #:
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Pub Dt:
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08/11/2022
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Inventors:
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Huilong ZHU, Tianchun YE
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Title:
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SEMICONDUCTOR APPARATUS WITH HEAT DISSIPATION CONDUIT IN SIDEWALL INTERCONNECTION STRUCTURE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC DEVICE
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO.3 BEITUCHENG WEST ROAD, CHAOYANG DISTRICT |
BEIJING, CHINA 100029 |
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JOHN P. FONDER |
11322 86TH AVENUE NORTH |
MAPLE GROVE, MN 55369 |
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